HYC at OFC 2025: Powering the Next Wave of Optical Interconnects for the AI Era

From April 1–3, OFC 2025—the 50th edition of the Optical Fiber Communication Conference and Exhibition—was held in San Francisco, bringing together global leaders in optical networking. As one of the most anticipated exhibitors, HYC unveiled a series of forward-looking innovations under the theme “Optical Interconnect Innovation for the AI Era.” Our latest products and solutions drew strong interest from customers and industry peers alike.

Multicore Fiber Assemblies

• Ready for AI-Driven Demands
  The explosion of AI workloads is driving data center connectivity toward higher bandwidth and integration. HYC’s compact Multicore Fiber (MCF) fan-in/fan-out (FI/FO) devices—measuring just L25 × φ2.5mm—are ready for volume production, offering a space-saving solution for next-gen architectures.

We also showcased MCF LC/SC connectors that support MCF-to-MCF connections. These connectors feature low insertion loss (as low as 0.35 dB) and high return loss (≥45 dB UPC), ensuring stable and reliable performance even after repeated mating.

High-Integration Optical Subassemblies

• For 800G/1.6T, and Silicon Photonic Modules
  At OFC, HYC demonstrated its ability to provide customized optical subassemblies by combining eight foundational components: MT/Mini MT, Jumpers, fiber arrays (FA), receptacles, isolators (FSI), fiber lens arrays, blocks, and prisms. Through advanced process integration and precision assembly, we support our customers from the design-in stage to accelerate product development.

A key highlight was our 2D Fiber Array, a critical component for Optical Circuit Switches (OCS). Utilizing a precision positioned matrix array to ensure high optical coupling efficiency. Fiber core offset ＜1μm (12x12CH).

Fiber Shuffle & High-Density Connectors

• Tailored for Co-Packaged Optics (CPO)
  Co-Packaged Optics is emerging as the future of high-performance computing interconnects. HYC’s fiber shuffle is built on a thin-film substrate, supporting fully customizable optical routing to meet the complex cabling demands within CPO modules. This solution helps optimize space, minimize crosstalk, and boost overall system reliability.

OFC 2025 was more than just a product showcase—it was a platform for HYC to engage deeply with global customers, exchange insights on the latest industry trends, and demonstrate our commitment to next-generation optical connectivity.

Driven by customer needs and powered by continuous innovation, HYC will continue to deliver smarter, faster, and more reliable optical interconnect solutions to support the evolution of AI, data centers, and next-gen networks.