Electronic stickers for the 'internet of things'

Engineers at Purdue University and the University of Virginia have developed a new fabrication method that makes tiny, thin-film electronic circuits peelable from a surface. The technique not only eliminates several manufacturing steps and the associated costs, but also allows any object to sense its environment or be controlled through the application of a high-tech sticker.

Full story: http://bit.ly/sensor-sticker

Featured Purdue Engineer:
Chi Hwan Lee, Assistant Professor, Weldon School of Biomedical Engineering

The work was supported by the Purdue Research Foundation, the Air Force Research Laboratory (AFRL-S-114-054-002), the National Science Foundation (NSF-CMMI-1728149) and the University of Virginia.

Music: "Bright White" by Podington Bear via Creative Commons at freemusicarchive.org

Purdue Engineering: http://engineering.purdue.edu/
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Purdue's College of Engineering is among the largest in the United States and includes 13 academic programs, all with high rankings. U.S. News and World Report ranks Purdue's College of Engineering in the Top 10 nationwide: no. 7 for graduate programs and no. 8 for undergraduate programs.

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